JPH0545065B2 - - Google Patents

Info

Publication number
JPH0545065B2
JPH0545065B2 JP25610486A JP25610486A JPH0545065B2 JP H0545065 B2 JPH0545065 B2 JP H0545065B2 JP 25610486 A JP25610486 A JP 25610486A JP 25610486 A JP25610486 A JP 25610486A JP H0545065 B2 JPH0545065 B2 JP H0545065B2
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
sealed semiconductor
leads
sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25610486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63108761A (ja
Inventor
Tamakazu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP25610486A priority Critical patent/JPS63108761A/ja
Publication of JPS63108761A publication Critical patent/JPS63108761A/ja
Publication of JPH0545065B2 publication Critical patent/JPH0545065B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP25610486A 1986-10-27 1986-10-27 樹脂封止型半導体装置 Granted JPS63108761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25610486A JPS63108761A (ja) 1986-10-27 1986-10-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25610486A JPS63108761A (ja) 1986-10-27 1986-10-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS63108761A JPS63108761A (ja) 1988-05-13
JPH0545065B2 true JPH0545065B2 (en]) 1993-07-08

Family

ID=17287943

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25610486A Granted JPS63108761A (ja) 1986-10-27 1986-10-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS63108761A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937656A (en) * 1988-04-22 1990-06-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH0286153A (ja) * 1988-09-22 1990-03-27 Toshiba Corp 樹脂封止型半導体装置
JP4450530B2 (ja) * 2001-07-03 2010-04-14 三菱電機株式会社 インバータモジュール
DE102007028512A1 (de) 2007-06-21 2008-12-24 Robert Bosch Gmbh Elektrisches Bauteil

Also Published As

Publication number Publication date
JPS63108761A (ja) 1988-05-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees